Highlights

  • Intel scheduled third-quarter results for 29 October, leaving second-quarter figures as the latest reported quarterly financial performance.
  • Second-quarter revenue increased 25% YoY to USD 16.1bn, alongside a reported net loss and positive adjusted earnings.
  • The Intel 18A process combines gate-all-around transistors with backside power delivery to improve semiconductor performance and efficiency.
  • The company's previous guidance placed third-quarter revenue between USD 15.8bn and USD 16.8bn, ahead of the forthcoming release.

A recovery in product revenue and continuing foundry development form the backdrop to the next earnings release at Intel Corporation (NASDAQ:INTC), which designs and manufactures semiconductors. The company will report its third-quarter performance on 29 October, after 26 October. Its existing financial outlook therefore remains guidance pending the release. Shares closed at USD 90.47, up 4.04%, after the market session ended on 26 October 2026.

Revenue Recovery Coexists With a Reported Loss

Revenue increased 25% YoY to USD 16.1bn in 2QFY26. GAAP gross margin improved to 40.4% from 27.5%, while operating margin reached 11.1%. Nevertheless, the company reported a USD 11.0bn net loss attributable to Intel, or USD 2.16 per share.

Non-GAAP net income was USD 2.2bn, with adjusted diluted earnings of USD 0.42 per share. Data Center and AI revenue rose 59% YoY to USD 6.3bn. The prior outlook for 3QFY26 called for revenue of USD 15.8bn–16.8bn, GAAP earnings of USD 0.31 per share and non-GAAP earnings of USD 0.38. A USD 12.53bn mark-to-market loss on escrowed shares under the United States government stock agreement materially affected GAAP earnings.

Foundry Design Targets Power and Density

Intel 18A combines RibbonFET gate-all-around transistors with PowerVia backside power delivery. RibbonFET surrounds transistor channels with the gate to improve control and reduce leakage, while PowerVia moves power routing to the back of the die. This separates part of the power network from signal routing.

The related 18A-P variant adds performance and thermal improvements, and 18A-PT extends the platform to three-dimensional integrated circuits. The latter uses additional vertical connections and hybrid bonding to support closer compute and memory integration. The technology programme addresses data centre, client and embedded designs, where power, thermal behaviour and interconnect density affect sustained performance. The process descriptions establish design capabilities rather than disclosing a new external customer revenue total.

The Scheduled Release Will Update the Financial Baseline

Intel confirmed the 29 October reporting date on 6 October. Results are due shortly after the market closes, with a management conference call scheduled for 2 p.m. Pacific time. Supporting materials and a replay will accompany the update through the company's investor relations channels.

Until that release, the July revenue outlook remains an expectation rather than a completed quarterly result. The scheduled discussion will provide the next opportunity for the company to report sales, margins and progress across products and manufacturing. Its timing also means the 26 October closing-price movement precedes publication of those earnings. June-quarter financial comparisons and the existing process technology disclosures remain the baseline before the forthcoming results.