Key Highlights

• NSING Technologies has shipped over 250 million Bluetooth chips incorporating Ceva's Bluetooth Low Energy IP across consumer, automotive, and industrial applications.

• The collaboration spans multiple product generations, including NSING's N32WB452 dual-core and N32WB03x ultra-low-power Bluetooth SoC series.

• Ceva's IP licensing model has powered more than 22 billion devices shipped globally through over 400 customers.

• The milestone supports Ceva's long-term Royalty Revenue stream as its connectivity IP underpins high-volume production cycles.

Ceva Inc (NASDAQ:CEVA), a licensor of silicon and software intellectual property for connected devices, announced on 5 November 2026 that its partner NSING Technologies has surpassed 250 million Bluetooth chip shipments incorporating Ceva's Bluetooth Low Energy IP. The achievement highlights the reach of Ceva's IP licensing Business model and its positioning within the broader semiconductor Supply chain for wireless connectivity solutions.

A Multi-Generational Partnership

The relationship between Ceva and NSING Technologies spans several product generations. NSING has built its Bluetooth product portfolio on Ceva-Waves Bluetooth LE IP, pairing Ceva's connectivity technology with its own low-power RF designs and MCU architectures. The result has been a lineup of highly integrated, power-efficient Bluetooth solutions that have found adoption across a diverse set of end markets.

Among the products leveraging this Partnership are NSING's N32WB452 series of dual-core Bluetooth LE microcontroller units and its N32WB03x series of ultra-low-power Bluetooth LE system-on-chips. These solutions serve applications ranging from electronic toll collection systems and wireless remote controls to smart lighting, e-bike security systems, indoor positioning, and industrial wireless connectivity. The breadth of these applications illustrates how Bluetooth LE technology has permeated everyday devices and commercial infrastructure.

Ceva's Licensing Model in Focus

The 250-million-unit milestone carries significance beyond a simple shipment figure. For Ceva, which operates primarily as an IP licensor rather than a chip manufacturer, each chip shipped by a customer like NSING translates into royalty revenue. The company's business model depends on its technology being embedded in high-volume production runs across a wide base of licensees.

Ceva reported that more than 22 billion devices have been shipped incorporating its IP globally, with over 400 customers licensing its technology. The company's Ceva-Waves wireless connectivity portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput, Wi-Fi, and Ultra-Wideband technologies, supported by integrated hardware and software solutions.

Ziv Hammer, Executive Vice President of Ceva's Connectivity and Sensing Division, noted that milestones like the NSING achievement demonstrate how the IP licensing model translates into sustained, high-volume production and long-term royalty opportunities. The company has positioned these wireless connectivity capabilities as part of its broader strategy to enable devices to connect, sense, and infer at the intelligent edge.

Market Context and Applications

NSING Technologies, which operates with dual headquarters in Shenzhen and Singapore, has established itself in microcontrollers and security integrated circuits. The company's product reach extends across consumer-grade, industrial-grade, and automotive-grade chips, with strategic directions focused on AI computing infrastructure, embodied AI, and on-device AI applications.

The Bluetooth LE market continues to expand as connected device adoption accelerates across industries. From wearables and IoT devices to automotive electronics and smart home infrastructure, wireless connectivity has become a foundational requirement. Ceva's position as a provider of the underlying IP places it at a critical juncture in this supply chain, though the company's revenue is dependent on the success of its licensees in their respective markets.

The partnership also aligns with industry trends toward increasingly integrated semiconductor solutions, where chip designers seek pre-validated IP blocks to accelerate time-to-market while maintaining performance and standards compliance. By licensing proven connectivity IP, companies like NSING can focus their engineering resources on differentiation in areas such as RF design and power management rather than developing wireless standards from the ground up.

What Lies Ahead

The NSING milestone adds to Ceva's track record of high-volume deployments and reinforces the company's relevance in the wireless connectivity IP market. As the semiconductor industry continues to evolve toward more connected and intelligent edge devices, Demand for pre-validated IP blocks like Ceva's Bluetooth LE solutions is expected to remain a recurring theme. The company's ability to maintain and expand its licensee base will be a Factor in sustaining its royalty-driven revenue model going forward.