Highlights

  • Sensor v6.5 commercially launched with on-device movement analysis and biofeedback.
  • CMOS fabrication completed for the RRAM validation chip through TSMC’s process.
  • Outreach to robotics developers to explore uses for its movement data library.
  • A$3.0 million placement announced after quarter end.

dorsaVi Limited (ASX:DVL) has released its quarterly activities report for the three months ended 30 September 2026. During the quarter, the company launched Sensor v6.5, progressed its first RRAM-CMOS validation chip through foundational fabrication, began RRAM energy characterisation and started exploratory engagement with robotics developers. The company noted that its RRAM and neuromorphic programs remain in development and are not integrated into Sensor v6.5 or any robotics product.

Sensor v6.5 Brings Feedback onto the Wearable

On 28 July 2026, dorsaVi commercially launched Sensor v6.5, its first wearable product to analyse movement and deliver a response directly on the device. The sensor runs the full measure, analyse, decide and act sequence without relying on a cloud connection or separate base device. It assesses movement quality, including patterns associated with injury risk, and can provide haptic, audible or visual biofeedback within milliseconds.

The product is built on the company’s established sensor platform, which has FDA clearance and TGA certification and has been used across clinical, elite sport, defence and occupational health settings. Sensor v6.5 runs on conventional silicon.

RRAM Chip Development and Robotics Outreach

dorsaVi moved its first RRAM-CMOS validation chip from design into physical wafer manufacturing during the quarter. The tape-out pathway began on 15 July, wafer processing started in August, and on 24 August the company confirmed completion of front-end-of-line transistor fabrication and middle-of-line interconnects using TSMC’s CMOS process. The next steps include proprietary RRAM integration and wafer-level electrical testing, which have not yet been completed.

On 14 September, the company began electrical measurements on its engineered RRAM structures to quantify the energy required to update memory states. dorsaVi noted this is a device-level characteristic and does not represent the total energy use of a robot, wearable or other system.

On 21 September, dorsaVi announced outreach to robotics companies to explore applications for its movement data library, built from more than a decade of real-world recordings, along with its bespoke wearable-sensor and Video AI capture capabilities. Initial areas of interest include balance, coordination and recovery in humanoid robotics. The company’s broader pathway links this data with its exclusively licensed neuromorphic IP and its RRAM program with NTU and ITRI, though integration into robotic systems remains subject to further engineering and validation.

Financial Position and Post-Quarter Placement

dorsaVi held cash of $1.12 million at 30 September 2026. Customer receipts for the quarter were $320k, compared with $185k in the same quarter a year earlier, while cash outflow from operating activities was about $0.996 million. After the quarter, the company received an FY26 R&D tax incentive rebate of $475k.

On 6 October 2026, dorsaVi secured firm commitments to raise A$3.0 million before costs through a placement of 136,363,636 shares at A$0.022 per share, with settlement expected on or around 19 October. The placement includes free-attaching options on a one-for-two basis, exercisable at A$0.045 and expiring three years from issue. Proceeds are intended to expand the movement data library and capture capability for robotics developers, advance the neuromorphic IP and RRAM programs, explore further Physical AI applications and support working capital.

Key Takeaways

dorsaVi’s September quarter combined a commercial product launch with progress on its longer-term RRAM and Physical AI ambitions. The company has been clear that its RRAM and neuromorphic work remains at an early, development stage. The post-quarter placement and R&D rebate add to its funding, while completion of RRAM integration and electrical testing, along with outcomes from robotics discussions, are key items to watch.