Highlights

  • dorsaVi Ltd (ASX:DVL) traded at AUD 0.025, up 8.70% during the morning session on 12 August 2026, while remaining down 37.50% over the past year.
  • The company commenced silicon fabrication of its first RRAM-CMOS validation chip, moving the program into physical wafer production.
  • The Manufacturing data package has completed foundry intake and entered the wafer fabrication sequence.
  • The current wafer run is producing the CMOS base structure that will support future RRAM memory integration.
  • The milestone supports dorsaVi’s broader RRAM platform development targeting Physical AI applications.

dorsaVi Ltd (ASX:DVL) was trading at AUD 0.025, up 8.70% during the morning session on 12 August 2026, while remaining down 37.50% over the past year. The company has announced that manufacturing of its first RRAM-CMOS validation chip has commenced, marking the transition of the program from design preparation into physical silicon production.

The milestone represents an important stage in dorsaVi’s semiconductor technology program, with wafer processing now underway at the foundry. The company is developing RRAM technology as part of its broader focus on ultra-edge intelligence, where artificial intelligence processing can occur closer to the point of data generation.

First RRAM-CMOS Validation Chip Enters Fabrication

dorsaVi confirmed that its manufacturing data package for the first RRAM-CMOS validation chip has been accepted into the semiconductor foundry fabrication flow.

The package, which includes design files, mask data, process documentation and wafer-lot instructions, has completed the required foundry intake process and has been released into the manufacturing sequence.

The commencement of wafer processing moves the program beyond design submission and manufacturing preparation, with physical silicon now being produced.

The company said the validation chip represents an initial step towards generating silicon-level data and process learnings that will support future RRAM technology development.

CMOS Base Manufacturing Underway Before RRAM Integration

The current wafer run is focused on producing the front-end CMOS base of the validation chip.

This CMOS structure will provide the foundation for later integration of the RRAM memory array, peripheral circuits and testing features.

Following completion of front-end CMOS processing, the wafers are expected to move through further stages including wafer release for partner-led integration, back-end-of-line (BEOL) preparation, RRAM stack integration and electrical characterisation.

dorsaVi said separating the manufacturing process into defined stages allows the company and its partners to assess progress and generate technical learnings throughout the development pathway.

RRAM Platform Targets Physical AI Applications

dorsaVi is developing its RRAM platform as a potential memory infrastructure technology for Physical AI applications, where systems require local processing capability rather than relying solely on cloud-based computing.

The company identified potential application areas including smart exoskeletons, robotics, autonomous systems such as drones and self-guided vehicles, and always-on Internet of Things (IoT) edge sensors.

dorsaVi stated that manufacturing the validation chip converts the RRAM program from a design activity into physical silicon that can be tested and demonstrated to potential partners and customers.

The company said each manufacturing stage provides additional process knowledge that may support future commercialisation activities, including device integration, Supply discussions and licensing opportunities.

CEO Highlights Role of Local AI Processing

dorsaVi Group Chief Executive Officer Mathew Regan said Physical AI requires systems to sense, decide and act in real time, creating Demand for memory technologies that reduce delays and energy consumption associated with data movement between memory and processing.

He said the company’s 22-nanometre RRAM program with Nanyang Technological University (NTU) and Industrial Technology Research Institute (ITRI) is designed to address these requirements by bringing memory and computing functions closer together.

Regan said the current 180-nanometre validation run is a key stage in the broader program, with silicon fabrication intended to generate technical learnings before progressing towards the subsequent 22-nanometre implementation.

Current Program Progress and Next Steps

Following completion of the CMOS base, dorsaVi expects the wafers to progress to partner-led processing and integration, where the RRAM layer will be added before testing and performance benchmarking.

The company said targeted characteristics for the technology include speed, energy efficiency, endurance and non-volatility, which are relevant to applications requiring local decision-making capabilities.

The validation program is intended to demonstrate the memory architecture through dorsaVi’s own sensing platform before any broader commercialisation activities.

Company Focus Extends Beyond Semiconductor Development

Alongside its RRAM and neuromorphic computing investments, dorsaVi continues to operate wearable sensor technology platforms focused on movement analysis and real-time data capture.

The company’s technology is used across workplace health and safety, clinical applications and elite sports, with its platforms designed to capture and assess human movement outside traditional laboratory environments.

dorsaVi’s ultra-edge strategy combines its existing sensor capabilities with investments in computing and memory technologies aimed at enabling artificial intelligence processing closer to the source of data.

Investor Takeaway

dorsaVi’s latest update marks the start of physical manufacturing for its first RRAM-CMOS validation chip, advancing the company’s semiconductor program from design completion into wafer production.

The company’s next steps include CMOS processing completion, RRAM integration, electrical testing and performance benchmarking. Investors may continue monitoring validation outcomes, technical progress and the company’s pathway towards potential commercial applications for its RRAM platform.